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An NSN is a 13-digit numeric code that serves to identify 'standardized material items of supply' as they have been recognized by all NATO countries and the United States Department of Defense. Aviation Gamut, owned and operated by ASAP Semiconductor, is an all-inclusive purchasing platform for hard-to-find and in-demand 058-004692-002 parts and components pertaining to the civil aviation, defense, aerospace, industrial, and electronic markets. As such, we have an inventory of more than two billion new and obsolete parts, among which is an unparalleled selection of NSN parts and much more. This includes items such as Microcircuit Memory 058-004692-002 from manufacturer Other and many more, all of which are available with short lead times and competitive prices. For NSN parts, Aviation Gamut is the ultimate source.
Specifications
Description
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NSN Information for Part Number 058-004692-002 with NSN 5962-01-299-6398, 5962012996398
Characteristics Data of NSN 5962-01-299-6398, 5962012996398
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 788.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |