| Part No | Description | Part Type | QTY | RFQ |
|---|---|---|---|---|
| ICK SMD C 10 SA | heat sink, for smd, 26c/w; packages cooled:smd; thermal resistan | NA | Avl | RFQ |
| SK0930ALSL | NA | NA | Avl | RFQ |
| TF 183 | socket transistor, to18, 3pin; connector type:transistor socket; | NA | Avl | RFQ |
| ICKLEDR54X20 | NA | NA | Avl | RFQ |
| ICK S R A 40 X 20 | led heatsink, with pins, round; thermal resistance:11.62c/w; for | NA | Avl | RFQ |
| SL11-139-06G | NA | NA | Avl | RFQ |
| MK01-3Z | NA | NA | Avl | RFQ |
| SL22 190 72Z | header, pin, 2.54mm, 72way; contact termination:through hole; no | NA | Avl | RFQ |
| FK224-SA-220-2 | NA | NA | Avl | RFQ |
| SK47025STS | NA | NA | Avl | RFQ |
| SL1-25-36Z | NA | NA | Avl | RFQ |
| ICKBGA23X23 | NA | NA | Avl | RFQ |
| FK 243 MI 247 H | heat sink, to-218/220/247, 19c/w; packages cooled:to-218 / to-22 | NA | Avl | RFQ |
| WLFT 404 53 X 53 | thermally conductive foil, adhesive; insulator material:polyimid | NA | Avl | RFQ |
| ISQ 05 | insulator, for crystal mounts; packages cooled:hc-18/u / hc-43/u | NA | Avl | RFQ |
| DFOB10 | NA | NA | Avl | RFQ |
| BL5 36Z | header, socket, 2.54mm, 36way; contact termination:through hole; | NA | Avl | RFQ |
| CONN HEADE FEMALE 2X | NA | NA | Avl | RFQ |
| MKLP 218 Z 100 | header, socket/2.0mm/100pol/dual row; series:mklp 218; contact t | NA | Avl | RFQ |
| FK 245 MI 247 O | heat sink, to-218/220/247, 20.2c/w; packages cooled:to-218 / to- | NA | Avl | RFQ |
| ICK SMD F 17 SA | heat sink, for smd, 42c/w; packages cooled:soic-24/28/32; therma | NA | Avl | RFQ |
| FK232-MI-220 | NA | NA | Avl | RFQ |
| WS220 | NA | NA | Avl | RFQ |
| SK 12550 SA | heat sink, eu card, 4.9 - 9.1c/w; thermal resistance:8.1c/w; ext | NA | Avl | RFQ |
| AOS218-247-1 | NA | NA | Avl | RFQ |
| MKLP 18 Z 50 | header, socket, 2.0mm, 50pol, single row; series:mklp 18; contac | NA | Avl | RFQ |
| SLLP1 09736 Z | header, pin, 2.54mm, 36way; contact termination:through hole; no | NA | Avl | RFQ |
| ICKLEDR33X10G | NA | NA | Avl | RFQ |
| SK57-37 5-SA | NA | NA | Avl | RFQ |
| BLY2 100Z | header, socket, 2mm, 100way; contact termination:through hole; n | NA | Avl | RFQ |
| ICK PGA 8 X 8 X 12 | led heatsink, with pins, square; thermal resistance:14.8c/w; for | NA | Avl | RFQ |
| ASLG-16G | NA | NA | Avl | RFQ |
| SL11-139-18G | NA | NA | Avl | RFQ |
| ABM2550-8 | NA | NA | Avl | RFQ |
| SK469-25-STS | NA | NA | Avl | RFQ |
| QS 25 GS | socket for crystals, precision; connector type:sip; series:qs; n | NA | Avl | RFQ |
| FEI4022 105 01404-LF | NA | NA | Avl | RFQ |
| ABM3050-10 | NA | NA | Avl | RFQ |
| ABM3050-40 | NA | NA | Avl | RFQ |
| SL22-112-20G | NA | NA | Avl | RFQ |
| TF 58 | socket transistor, to5, 8pin; connector type:transistor socket; | NA | Avl | RFQ |
| CAB 4 GS | jumper, 2.54mm, black; accessory type:jumper; for use with:0.6 t | NA | Avl | RFQ |
| BL118Z | NA | NA | Avl | RFQ |
| ICK SMD A 8 SA | heat sink, for smd, 87c/w; packages cooled:dil-8 / ssop-20/24/28 | NA | Avl | RFQ |
| BLY4-12 | NA | NA | Avl | RFQ |
| SL2 025 72G | header, pin, 2.54mm, 72way; contact termination:through hole; no | NA | Avl | RFQ |
| FEI4022 303 10023-LF | NA | NA | Avl | RFQ |
| WLFT 404 48 X 48 | thermally conductive foil, adhesive; insulator material:polyimid | NA | Avl | RFQ |
| FK224-MI220-1 | NA | NA | Avl | RFQ |
| ICK35-SA-220 | NA | NA | Avl | RFQ |
| GBM3050-10 | NA | NA | Avl | RFQ |
| SK 04100 SA | heat sink, 100mm; packages cooled:to-3; thermal resistance:1.5c/ | NA | Avl | RFQ |
| SK96-50-SA | NA | NA | Avl | RFQ |
| FK 244 08 D2 PAK | heat sink, for d-pak, 29.3c/w; packages cooled:to-263; thermal r | NA | Avl | RFQ |
| SLLP1112-3G | NA | NA | Avl | RFQ |
| AKK 191 | heat sink, to-3, 12c/w; packages cooled:to-3; thermal resistance | NA | Avl | RFQ |
| ISQ 08 | insulator, for crystal mounts; packages cooled:hc-25/u / hc-42/u | NA | Avl | RFQ |
| SK145-25STS-TO220 | NA | NA | Avl | RFQ |
| GB29LME | profiles for 19 subracks; external height:10.0mm; external widt | NA | Avl | RFQ |
| SK400-40-2XM3L | NA | NA | Avl | RFQ |
| THFU1 | NA | NA | Avl | RFQ |
| ICKSR54X30 | NA | NA | Avl | RFQ |
| SK 10050 SA | heat sink, 50mm, 2.5c/w; thermal resistance:2.5c/w; external wid | NA | Avl | RFQ |
| ASLG 16 Z | protective shroud, header, 2.54mm, 16pol; series:aslg; contact t | NA | Avl | RFQ |
| MK 0550G | header, 2.54mm, 50way; contact termination:through hole; no. of | NA | Avl | RFQ |
| SL22-139-72G | NA | NA | Avl | RFQ |
| ICKLEDR29X11 5 | NA | NA | Avl | RFQ |
| SLLP1112-2G | NA | NA | Avl | RFQ |
| ICK SMD F 26 SA | heat sink, for smd, 26c/w; packages cooled:smd; thermal resistan | NA | Avl | RFQ |
| SL22 124 72 G | header, pin, 2.54mm, 72way; contact termination:through hole; no | NA | Avl | RFQ |
| SL11-112-36Z | NA | NA | Avl | RFQ |
| SL1 025 36Z | header, pin, 2.54mm, 36way; contact termination:through hole; no | NA | Avl | RFQ |
| SLY9SMD-040-5G-B-SM | NA | NA | Avl | RFQ |
| WLFT 404 43 X 43 | thermally conductive foil, adhesive; insulator material:polyimid | NA | Avl | RFQ |
| SLLP2 112 72Z | header, pin, 2.54mm, 2x72way; contact termination:through hole; | NA | Avl | RFQ |
| FK 222 MI 220 | heat sink, to-220, 20c/w; packages cooled:to-220; thermal resist | NA | Avl | RFQ |
| CAB9G-BLACK | NA | NA | Avl | RFQ |
| GBM3050-15 | NA | NA | Avl | RFQ |
| SK126-37 5-2XM3 | NA | NA | Avl | RFQ |
| SL11 SMD 062 40S | header, pin, 2.54mm, 40way; contact termination:surface mount ve | NA | Avl | RFQ |
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